GB/T 41852-2022半导体器件微机电器件MEMS结构黏结强度的弯曲和剪切试验方法国家标准
英文:Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength...
英文:Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength...