GB/T 36477-2018半导体集成电路快闪存储器测试方法国家标准
英文:Semiconductor integrated circuit—Measuring methods for flash memory GB/T 36477-2018介绍: 国家标准《半导体集成电路 快闪存储器测试方法》由TC78(全...
英文:Semiconductor integrated circuit—Measuring methods for flash memory GB/T 36477-2018介绍: 国家标准《半导体集成电路 快闪存储器测试方法》由TC78(全...
英文:Integrated circuits—Test methods for column grid array GB/T 36479-2018介绍: 国家标准《集成电路 焊柱阵列试验方法》由TC78(全国半导体器件标准化技术委员会)归口...
英文:Integrated circuits—Memory devices pin configuration GB/T 36614-2018介绍: 国家标准《集成电路 存储器引出端排列》由TC78(全国半导体器件标准化技术委员会)归口上报...
英文:Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) o...
英文:Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid fil...
英文:Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybri...
英文:Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments GB/T 38341-...
英文:Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films GB/T 3844...
英文:Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration GB/T 3844...
英文:Itegrated circuit (IC)card packaging framework GB/T 39842-2021介绍: 国家标准《集成电路(IC)卡封装框架》由TC78(全国半导体器件标准化技术委员会)归口上报,TC78S...