GB/T 20870.5-2023半导体器件第16-5部分:微波集成电路振荡器国家标准
英文:Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators GB/T 20870.5-2023介绍: 国家标准《半导体器件 第16-5部分:微波...
英文:Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators GB/T 20870.5-2023介绍: 国家标准《半导体器件 第16-5部分:微波...
英文:Semiconductor devices—Part 16-2: Microwave integrated circuits—Frequency prescalers GB/T 20870.2-2023介绍: 国家标准《半导体器件 第...
英文:Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...
英文:Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...
英文:Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated elec...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling GB/T 4937.34-2024介绍: 国家标准《半导体器件 机械和气...
英文:Semiconductor devices—Part 5-5: Optoelectronic devices—Photocouplers GB/T 15651.5-2024介绍: 国家标准《半导体器件 第5-5部分:光电子器件 光电耦...
英文:Micro-electromechanical systems technology(MEMS) —Description and measurement methods for micro trench and pyramidal ...
英文:Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement GB/T 41853-2022介绍: ...