标签：其他半导体分立器件国家标准

英文：Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...

英文：Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...

英文：Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power...

英文：Micro-electromechanical systems technology（MEMS） —Description and measurement methods for micro trench and pyramidal ...

英文：Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement GB/T 41853-2022介绍： ...

英文：Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength...

英文：Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS GB/T 32817-2016介绍： 国家标准《半导体器件 微机...