GB/T 43452-2023模拟/混合信号知识产权(IP)核交付项要求国家标准
英文:Requirements for analog/mixed-signal intellectual property(IP) core deliverables GB/T 43452-2023介绍: 国家标准《模拟/混合信号知识产权(...
英文:Requirements for analog/mixed-signal intellectual property(IP) core deliverables GB/T 43452-2023介绍: 国家标准《模拟/混合信号知识产权(...
英文:Analog/mixed-signal intellectural property(IP)core quality evaluation GB/T 43455-2023介绍: 国家标准《模拟/混合信号知识产权(IP)核质量评测》由T...
英文:Three dimensional integrated circuits—Part 2:Alignment of stacked dies having fine pitch interconnect GB/T 43536.2-20...
英文:Integrated circuit TSV 3D package reliability test methods guideline GB/Z 43510-2023介绍: 国家标准《集成电路TSV三维封装可靠性试验方法指南》由TC...
英文:Three dimensional integrated circuit—Part 1:Terminologies and definitions GB/T 43536.1-2023介绍: 国家标准《三维集成电路 第1部分:术语和定义...
英文:Design requirements of integrated circuit intellectual property (IP) core GB/T 43454-2023介绍: 国家标准《集成电路知识产权(IP)核设计要求》由...
英文:Quality and technical requirements for metal packages used for integrated circuits GB/T 43538-2023介绍: 国家标准《集成电路金属封装外壳...
英文:Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process GB/T 32814-...
英文:Silicon-based MEMS fabrication technology—Specification for criterion of the bulk silicon piezoresistance process GB/...
英文:Silicon-based MEMS fabrication technology—Specification for criterion of the combination of the deep etching and bond...