GB/T 41852-2022半导体器件微机电器件MEMS结构黏结强度的弯曲和剪切试验方法国家标准
英文:Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength...
英文:Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength...
英文:Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS GB/T 32817-2016介绍: 国家标准《半导体器件 微机...
英文:Screening specifications for illumination LEDs in space sciences GB/T 32872-2016介绍: 国家标准《空间科学照明用LED筛选规范》由TC312(全国空间科学...
英文:The rule of type designation for discrete semiconductor devices GB/T 249-2017介绍: 国家标准《半导体分立器件型号命名方法》由TC78(全国半导体器件标准化技...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount dev...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere GB/T 4937.13-2018介绍: 国家标准《半导体器件 机...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength GB/T 4937.19-2018介绍: 国家标准《半导体器...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) GB/T 4937.18-2018...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency GB/T 4937.12-2018介绍...