GB/T 4937.15-2018半导体器件机械和气候试验方法第15部分:通孔安装器件的耐焊接热国家标准
英文:Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-h...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-h...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the co...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength GB/T 4937.22-2018介绍: 国家标准《半导体器件 机械和...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of su...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity) GB/T 4...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability GB/T 4937.21-2018介绍: 国家标准《半导体器件 机械和...
英文:Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation GB/T 4937.17-2018介绍: 国家标准《半导体...
英文:Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package ou...
英文:Technical specification of power electronic devices for high-voltage direct current (HVDC) transmission using voltage...